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sintering, and ensuring HDI packaging compatibility The project supports Europe's digitalization through chiplet technology development. EISLAB leads the electronics packaging, targeting applications in IoT
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for the design of materials with unique electromagnetic properties not found in nature and electromagnetic compatibility for electronics systems, IoT systems, electric vehicles and an electrification
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skills and high proficiency in oral and written communication in English. Experience in IoT and real word experimentation will be highly considered as a merit. For further information about a specific
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broadband and IoT services to all rural areas and remote locations with high energy efficiency. To achieve this goal and to avoid interference, signals from satellites, ground and base stations, and many
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to sustainable societies. The Department of Electrical Engineering conducts successful research and education in the areas - renewable energy sources, electric vehicles, industrial IoT, 6G communication and
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based integration of software-defined CPS (Cyber-Physical Systems) and IoT devices. -Replication and software updates during runtime for mission-critical devices and systems. -Model based engineering
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, IoT, and SoS automation architecture and the use of AI and Machine Learning (ML). Targeted results include academic papers and contributions with open-source code for the Eclipse Arrowhead. Projects
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energy sources, electric vehicles, industrial IoT, AI, 6G communication and wireless sensor networks as well as research and education within Life Science, smart electronic sensors and medical systems
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-to-edge continuum for flexible and adaptable distributed systems. The projects aim to further digitalize the European industry, where EISLAB will be responsible for the CPS intelligence, IoT, and SoS
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financial transactions and activities as well as support audits. The projects aim to further digitalize the European industry, where EISLAB will be responsible for the CPS intelligence, IoT, and SoS