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materials such as semiconductor nanowires, graphene, or two-dimensional semiconductors. They will have experience with designing, fabricating and characterising arrays of devices such as integrated circuits
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materials such as semiconductor nanowires, graphene, or two-dimensional semiconductors. They will have experience with designing, fabricating and characterising arrays of devices such as integrated circuits
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research on biomedical sensor applications (biomedical sensor interfaces/ integrated mechanical strain sensors) analog/Mixed-Signal Integrated Circuit Design (CMOS, low-power, low-noise design) publication
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neuropathology and how biological sex influences these processes at the behavioral, circuit, and synaptic level. Our laboratory employs a multi-level approach that incorporates transgenic mouse and rat lines
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Description The Institute of Radio Frequency Engineering and Electronics conducts research in the field of integrated circuit design in state-of-the-art CMOS and SiGe BiCMOS technologies for various
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-CMOS integrated circuits to interface quantum computers and quantum sensors! Job description Quantum computers promise to solve problems intractable by classical digital computers, while quantum sensors
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The Max Planck Institute for Neurobiology of Behavior – caesar • | Bonn, Nordrhein Westfalen | Germany | about 13 hours ago
environment that provides novel technologies to elucidate the function of brain circuits from molecules to animal behaviour. The comprehensive and diverse expertise of the faculty in the exploration of brain
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University Hospital, Duke Regional Hospital, Duke Raleigh Hospital, Duke Health Integrated Practice, Duke Primary Care, Duke Home Care and Hospice, Duke Health and Wellness, and multiple affiliations. A
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rigid electrodes, dielectric fluid, and elastomer material to host the electrodes. By stacking multiple DFG units, it is possible to create a flexible direct generation module for integration
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Indium Phosphide (InP) technology, which significantly improves performance of mm-wave circuits. Consequently, CMOS and InP chips need to be efficiently combined/integrated in order to maximize