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patterning and key process steps High-speed analog/RF Neuromorphic computing Next-generation logic devices Novel memory concepts Quantum computing Data science and data security GaN power electronics Image
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technology is successfully offered via wafer-level prototype fabrication services to customers in telecom, datacom, computing, bio-medical, and sensing applications. Among the major building blocks within a
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, you are involved in research activities where Die to wafer bonding is required (3D integrated systems, image sensors, photonics, biomedical devices, quantum computing,...). More specifically, you will
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in developing integrated silicon photonics technology through its renowned iSiPP platform and PDK, and Optical I/O R&D program. This technology is successfully offered via wafer-level prototype