3 high-performance-computing positions at Université de Sherbrooke

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PHD offer- Design, Fabrication and Characterization of Embedded Vapor Chamber Cooling for High-Density Fan-Out Wafer Level Packages (FOWLP)

Université de Sherbrooke | Sherbrooke East, Quebec | Canada | 3 months ago

performance through heterogeneous integration. Traditional methods struggle to meet the demands of high-performance computing, AI, aerospace, and defense. Fan-Out Wafer-Level Packaging (FOWLP) has received
PhD Offer-Development of molding processes for heterogeneous integration of large electronic chips

Université de Sherbrooke | Sherbrooke East, Quebec | Canada | 3 months ago

for the evolution of microelectronics, enhancing performance through heterogeneous integration. Traditional methods struggle to meet the demands of high-performance computing, AI, aerospace, and defense. Fan-Out
Postdoctoral Fellow-Temporary Bonding and Debonding Processes for Fan-Out Wafer-Level Packaging

Université de Sherbrooke | Sherbrooke East, Quebec | Canada | 3 months ago

realized under the co-direction of Pr. Dominique Drouin and Pr. Serge Ecoffey, as part of the IBM/NSERC Alliance Project on Multi-Chip Heterogeneous Integration for High Performance Computing. The work will

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