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high-performance servers and a small cluster, as well as access to the University's central computing facilities and the High-Performance Computing Initiative. More details can be found at https
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packaging manufacturing, with an emphasis on novel process integration, heterogeneous integration, wafer-to-wafer and chiplet bonding, and materials systems for high-density, high-performance devices. Silicon
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for interdisciplinary collaboration. The School has excellent computing resources that include individual faculty workstations, several high-performance servers and a small cluster, as well as access to the University's
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