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- 23:59 (Europe/Berlin) Type of Contract Temporary Job Status Negotiable Offer Starting Date 23 Oct 2025 Is the job funded through the EU Research Framework Programme? Other EU programme Is the Job
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Rheinland-Pfälzische Technische Universität Kaiserslautern-Landau | Kaiserslautern, Rheinland Pfalz | Germany | about 1 month ago
2 Oct 2025 Job Information Organisation/Company Rheinland-Pfälzische Technische Universität Kaiserslautern-Landau Department Computer Science Research Field Computer science » Informatics Researcher
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BiCMOS technologies. What you will do As a trainee in our Analog IC Design program, you will participate in a comprehensive introduction to Analog IC Design and RFIC Design, collaborating on real projects
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Germany Application Deadline 16 Nov 2025 - 22:59 (UTC) Type of Contract To be defined Job Status Other Is the job funded through the EU Research Framework Programme? Not funded by a EU programme Is the Job
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explore the effort required to implement a geofence solution that meets a specified Agricultural Performance Level (AgPL). It will examine which technical solutions are necessary and which components
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, computer science, medicine, pharmacology, and physics. ISAS is a member of the Leibniz Association and is publicly funded by the Federal Republic of Germany and its federal states. At our location in
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to provide a high-performing digital infrastructure for industrial and public service applications. Alongside its scientific goals, OpenEuroLLM emphasizes the importance of developing a strong community around
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matter, nanotechnology, and drug delivery; high-throughput platforms and molecular/cellular biosensors; computational bioengineering and AI for modeling, design, and prediction. The Max Delbrück Center
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MPE is a world-renowned institute in both space- and ground-based experimental astrophysics, playing leading roles in numerous major astronomical missions and projects. The high-energy group carries
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cost-efficient and high-performance material in packaging solutions. With the continuous advancement of power electronics, the demand for innovative packaging technologies that ensure high thermal and