Sort by
Refine Your Search
-
performance through heterogeneous integration. Traditional methods struggle to meet the demands of high-performance computing, AI, aerospace, and defense. Fan-Out Wafer-Level Packaging (FOWLP) has received
-
National Research Council Canada | National Capital Region Almonte, Ontario | Canada | about 11 hours ago
competitively and must demonstrate the ability to perform original, high-quality research in their chosen field. Research Associates will be offered appointments to the staff of the National Research Council on a
-
for the evolution of microelectronics, enhancing performance through heterogeneous integration. Traditional methods struggle to meet the demands of high-performance computing, AI, aerospace, and defense. Fan-Out
-
Spintronics, Complex systems, Theoretical Mathematical Science, Big Data, Mechanobiology / Physical Biology, Bio-energy, Genetic to Physiology, Mental Health, High Performance Computation in Physics, Chemistry
-
Leong Scholar should not only be a person of high intellect but a well-rounded person of sound character. Renewal of scholarship funding for up to the full four years is conditional upon recipients making