2 high-performance-computing-postdoc PhD positions at Université de Sherbrooke in Canada

PHD offer- Design, Fabrication and Characterization of Embedded Vapor Chamber Cooling for High-Density Fan-Out Wafer Level Packages (FOWLP)

Université de Sherbrooke | Sherbrooke East, Quebec | Canada | 3 months ago

performance through heterogeneous integration. Traditional methods struggle to meet the demands of high-performance computing, AI, aerospace, and defense. Fan-Out Wafer-Level Packaging (FOWLP) has received

PhD Offer-Development of molding processes for heterogeneous integration of large electronic chips

Université de Sherbrooke | Sherbrooke East, Quebec | Canada | 3 months ago

for the evolution of microelectronics, enhancing performance through heterogeneous integration. Traditional methods struggle to meet the demands of high-performance computing, AI, aerospace, and defense. Fan-Out