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program, imagers & specialty component program, quantum computing program) and joint development programs with external partners. Work cross-functionally with the integration/process support/hardware teams
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analysis Thermal integrity in 2.5D packaging Advanced design technology co-optimization Parasitic extraction for large cells Area-selective deposition for nanoscale structures ...and more! By bridging
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Engineering or relevant STEM degree, preferably with early career experience. Experience with performance analysis of HPC applications, such as molecular dynamics or computational fluid dynamics. Experience
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characterization data. Design and execute development plans, including DOE setup, in-line characterization strategy, pilot line follow-up, and data analysis. Module Robustness & Scalability: Apply industry
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based on electrical and characterization data. Design and execute development plans, including DOE setup, in-line characterization strategy, pilot line follow-up, and data analysis. Module Robustness