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RAP opportunity at National Institute of Standards and Technology NIST Scientific machine learning methods for trustable accelerated materials characterization and design Location Material
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RAP opportunity at National Institute of Standards and Technology NIST Low-Damage Earthquake-Resistant Structures Location Engineering Laboratory, Materials and Structural Systems Division
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RAP opportunity at National Institute of Standards and Technology NIST Advanced Imaging of Biomaterials and Smart Polymers Location Material Measurement Laboratory, Biosystems and Biomaterials
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RAP opportunity at National Institute of Standards and Technology NIST Chip-scale atomic magnetometers Location Physical Measurement Laboratory, Time and Frequency Division opportunity location
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RAP opportunity at National Institute of Standards and Technology NIST Diffusion in Advanced Materials Location Material Measurement Laboratory, Materials Science and Engineering Division
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RAP opportunity at National Institute of Standards and Technology NIST Measuring Cell Viability in Scaffolds Location Material Measurement Laboratory, Biosystems and Biomaterials Division
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Microstructure of Structural and Functional Ceramics for Additive Manufacturing, Energy Conversion and Storage NIST only participates in the February and August reviews. Control of microstructure, internal dynamics, materials physics and chemistry is of primary importance in determining the...
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Metrology and Prototyping of Wide-Bandgap Semiconductor Quantum Nanowire Structures and Devices NIST only participates in the February and August reviews. Semiconductor quantum nanowires offer new applications in areas such as chemical sensors, NEMs, nanolasers, and nanoscale thermoelectric...
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RAP opportunity at National Institute of Standards and Technology NIST Measurement Science to Promote Water Quality and Health in Aquaculture Location Material Measurement Laboratory, Chemical
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traditional thin-film devices include exceptional structural quality, high surface-to-volume ratio, bottom-up device engineering with high-density on-chip integration, and utilization of quantum size effects