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Description The TRR404 “Next Generation Electronics With Active Devices in Three Dimensions [Active-3D]” is a Collaborative Research Center/Transregio between TUD Dresden University of Technology
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, or medicinal chemistry enthusiasm to contribute to and lead cutting-edge research in the fascinating world of glycosciences (should be reflected in cover letter) accurate note-keeping through electronic
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@es.uni-tuebingen.de . Enquiries may also be sent to this email address. Application deadline: July 20, 2025 Equally qualified applicants with disabilities will be given preference in the hiring process
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Computer-adaptive methods and multi-stage testing Application of machine learning in psychometrics Predictive modeling of educational data Methodological challenges in cohort comparisons Advanced meta
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computer vision in dusty conditions by incorporating hyperspectral cameras. In addition, assisting in project applications and general development duties of the Chair. The position is available from
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service or the time stamp on the email server of TUD applies), preferably via the TUD SecureMail Portal https://securemail.tu-dresden.de by sending it as a single PDF file quoting the reference number"RTG2861-A4" in
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service or the time stamp on the email server of TUD applies), preferably via the TUD SecureMail Portal https://securemail.tu-dresden.de by sending it as a single PDF file quoting the reference number"RTG2861-A4" in
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service or the time stamp on the email server of TUD applies), preferably via the TUD SecureMail Portal https://securemail.tu-dresden.de by sending it as a single PDF file quoting the reference number“RTG2861-A4” in
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at the interface of nonlinear terahertz spectroscopy, spin-orbitronics and ultrafast transport: 1) Ultrafast transport of electron orbital angular momentum in spin-orbitronic multilayers https://www.fu-berlin.de
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describing your scientific accomplishments and your interests in our group and its research, your CV and bibliography, as well as contact information for at least two references, in electronic form via