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candidate will be enrolled in one of the general degree programmes at DTU. For information about our enrolment requirements and the general planning of the PhD study programme, please see DTU's rules
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academic approval, and the candidate will be enrolled in one of the general degree programmes at DTU. For information about our enrolment requirements and the general planning of the PhD study programme
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about the network as a whole, its scientific content, and the application and selection process here . All positions are fully funded, with very competitive salaries. More information on funding from
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PhD scholarship in Biomaterials-based Approach for the Creation of Artificial Red Blood Cells - D...
in one of the general degree programmes at DTU. For information about our enrolment requirements and the general planning of the PhD study programme, please see DTU's rules for the PhD education
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Approval and Enrolment The scholarship for the PhD degree is subject to academic approval, and the candidate will be enrolled in one of the general degree programmes at DTU. For information about our
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be important. You are expected to actively contribute to joint research projects, experimental design, and data interpretation across disciplinary boundaries. Responsibilities and qualifications Your
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.), especially for international candidates through our international staff office (ISO) and the administrative staff at POLIMA. For further information about the positions and the research center, contact
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are looking for a person with a relevant degree (e.g. health economics, economics, statistics, data science, public health science). Are you passionate about contributing to a groundbreaking interdisciplinary
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Engineering, respectively, will be important. You are expected to actively contribute to joint research projects, experimental design, and data interpretation across disciplinary boundaries. Responsibilities
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improving thermal management for data center power applications. Your primary tasks will include: Exploring innovative magnetics and capacitors integrations. Investigating advanced packaging techniques