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to the table Full-time student at a university in Berlin, preferably in the field of electrical or computer engineering, mathematics, physics Profound knowledge in the field of digital signal processing
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programme You enjoy working independently and on your own responsibility Initial knowledge of materials science and design theory is an advantage for you Good German and English skills are essential
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What you bring to the table You are a student of industrial engineering, mechanical engineering or a related degree programme You support our dynamic team with your independent and autonomous way
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you bring to the table You are a student of industrial engineering, mechanical engineering or a related degree programme You are characterised by an independent way of working and enjoy practical
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Student Assistant (m/f/d)- Software Development for Cutting-Edge Autonomous Outdoor Robot Navigation
Advertisement for the field of study such as: automation technology, electrical engineering, computer science, control engineering, software design, software engineering, technical computer science
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you can expect By joining this PhD programme, you will be part of a world-class research programme in the fields of biopolymers and materials sciences for healthcare. As a PhD candidate, you will be
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We, the Fraunhofer Institute for Computer Graphics Research IGD, are looking for a student assistant for our Competence Center "3D Printing Technology" to join our team in the field of software
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engineering or a related field Excellent knowledge and several years of proven experience in the epitaxy of III-V semiconductors using MBE Excellent knowledge of epitaxy analytics Proven experience in operating
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and results, final presentation to the team What you bring to the table • Studium im Bereich Angewandte Mathematik, Technomathematik, Computational Science, Physik oder Vergleichbares
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The department System Packaging focuses on innovative packaging technologies for microelectronics and power electronics. The main emphasis lies on the development of reliable interconnection and bonding techniques that meet increasing demands in thermal and mechanical stability. In the context...