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on heterogeneous integration and security of chiplet-based IC systems. This role involves research and development in chiplet-based architectures, aiming to demonstrate secure intelligent computing platforms
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on heterogeneous integration and security of chiplet-based IC systems. This role involves research and development in chiplet-based architectures, aiming to demonstrate secure intelligent computing platforms
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novel research methodologies in computer vision, deep learning architectures, and neuro-fuzzy systems to contribute to the development of robust AI frameworks for medical diagnosis and treatment support
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equivalent) in Geospatial Sciences, Computer Sciences, Architecture and Urban Planning, Environmental Sciences, Geography, Landscape Ecology, or any other related field. • Strong research background in
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for long-term roadmap development. Job Requirements: MSc or PhD in Electrical Engineering, Electronics Engineering, AI, Chip Design, Computer Science, Cybersecurity, or a related field Proven experience with
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and thermal-aware design techniques for embedded systems. Contribute to research outputs and support timely completion of project milestones. Job Requirements: Preferably PhD in Computer Engineering
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infrastructure security R&D. Job Requirements: A PhD in Computer Science, Software Engineering, Artificial Intelligence, or a related discipline. Proven research track record demonstrated by publications in top
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, architecture, material engineer. The Research Fellow will be responsible for conducting and leading simulations, field measurements, data analysis, as well as laboratory and field testing throughout the duration
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projects. Disseminate research findings through conferences, invited talks, and outreach activities, strengthening NTU’s leadership in infrastructure security R&D. Job Requirements: A PhD in Computer
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Requirements: A PhD in Computer Science, Software Engineering, Artificial Intelligence, or a related discipline Proven research track record demonstrated by publications in top-tier venues (e.g., IEEE S&P