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(goals, experiences, and skills relevant to the opportunity) Resume (PDF) Transcripts/Academic Records - Please upload a copy of a transcript for your current or most recent degree program that meets
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Combat Capabilities Development Command, Soldier Center (DEVCOM-SC) is offering an internship opportunity in the U.S. Army’s Food Additive Manufacturing (3D food printing) program. What will I be doing? As
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technology, multifunctional technology, combustion processes, propulsion and flight physics, communication and networking, and computational and information sciences. About PHOTONICS, ELECTRONICS, & QUANTUM
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computer programming and/or computer science Completed coursework in chemistry, physics, and biology (Advanced Placement or Honors courses preferable) Application Requirements A complete application consists
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to the opportunity) Resume (PDF) Transcripts/Academic Records - Please upload a copy of a transcript for your current or most recent degree program that meets the disciplinary qualifications of the opportunity. Click
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in Zintellect, they must click the unique link in each email request, but will be given the opportunity to copy over what they had previously submitted. All documents must be in English or include
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(PDF) Transcripts/Academic Records - Please upload a copy of a transcript for your current or most recent degree program that meets the disciplinary qualifications of the opportunity. Click here
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/Academic Records - Please upload a copy of a transcript for your current or most recent degree program that meets the disciplinary qualifications of the opportunity. Click here for detailed information about
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professional goals. Along the way, you will engage in activities and research in several area. These, include, but are not limited to: Process and analyze data from various biomechanical sources including
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Program Website . After reading, if you have additional questions about the application process, please email USDA-APHIS@orau.org and include the reference code for this opportunity. Qualifications