36 computational-geometry Postdoctoral positions at Stony Brook University in United States
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their research areas compliment those of current department members. Applications should be received by November 15, 2024. Research Assistant Professor - The Simons Center for Geometry & Physics has two open
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Job Description Required Qualifications: (as evidenced by an attached resume) Doctoral Degree (or foreign equivalent) in Computer Science, Electrical and Computer Engineering, Applied Mathematics or a
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Postdoctoral Associate- Artificial Intelligence Innovation Required Qualifications: (as evidenced by an attached resume) Doctoral Degree (or foreign equivalent) in Computer Science, Electrical and
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Postdoctoral Associate- Artificial Intelligence Innovation Required Qualifications: (as evidenced by an attached resume) Doctoral Degree (or foreign equivalent) in Computer Science, Electrical and
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Associate will assist a Principal Investigator Leon Shterengas in the Department of Electrical and Computer Engineering . The incumbent will conduct research on semiconductor photonic device nanofabrication
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experiments are appropriately conducted following the policies and procedures of Stony Brook University. The successful candidates will work on the parity- violating electron scattering (PVES ) program at
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. Participation in professional advocacy activities. Qualifications Required Qualifications: Possession of a Doctorate in Psychology from a program accredited by the American Psychological Association (APA
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. Participation in professional advocacy activities. Qualifications Required Qualifications: Possession of a Doctorate in Psychology from a program accredited by the American Psychological Association (APA
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Computer Engineering or a closely related field, completed by the start date of the appointment. Research experience in at least one of the following areas: ● Chip design, tape-out, and testing
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Computer Engineering or a closely related field, completed by the start date of the appointment. Research experience in at least one of the following areas: ● Chip design, tape-out, and testing