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. A minimum B2 level of English, (or equivalent) is required, as established by the list of language certificates accepted by ACLES and CRUE (Conference of Chancellors of Spanish Universities):Language
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Engineering From chip to ship. From machine to human being. From idea to solution. Driven by a deep-rooted desire to understand our environment and discover its underlying mechanisms, research and education at
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for building the next generation of semiconductor quantum chips! You will be part of the LIST Materials Research and Technology department, where you will carry out your work in the Quantum Materials
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. Change. Impact! Faculty Mechanical Engineering From chip to ship. From machine to human being. From idea to solution. Driven by a deep-rooted desire to understand our environment and discover its
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questions such as: How many archaic humans contributed to our genomes? How many times did we encounter them and how long did we coexist? When did they go extinct? How do their genes affect us today? Are there
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) with integrated passives can play a key role as a part of the PDN in enhancing power efficiency and performance in HPC systems. IVRs either in package or on-chip, provide voltage regulation closer
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skills and personal interests. This is what you will do This PhD project is expected to go back and forth between methodological and theoretical developments; and applied works toward the clinical
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Max Planck Institute for Demographic Research (MPIDR) | Rostock, Mecklenburg Vorpommern | Germany | about 1 month ago
are complemented by the MPIDR’s own initiatives. For more information, see: www.demogr.mpg.de/go/work-family . In addition, there are a range of central initiatives and measures primarily geared towards helping
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. The system will include: A very compact, ultra-low-power analog front-end (AFE) to sense neural signals. An on-chip neuromorphic processor to convert the neural data into spike-based encoded data and
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HPC systems. IVRs either in package or on-chip, provide voltage regulation closer to the load, enabling miniaturization and modularity while reducing resistive losses due to shorter PDN interconnects