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interconnects, (ii) characterization of mechanical stress and radiation-damage effects in photonics components integrated on a conventional silicon substrate and (iii) preparation of samples to be used for x-ray
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exposure, infrared (IR) spectroscopy, and EUV lithography. This work is part of a larger effort to design photoresist materials for the next-generation EUV lithography for Angstrom-era semiconductor chip
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-on experience in FPGA programming in VHDL or Verilog language and development of firmware for standalone microcontrollers or SoC chips Knowledge of I/O and communication standards, e.g., SPI, I2C, USB 2/3, PCIe
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