1 big-data Fellowship positions at Université de Sherbrooke

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Postdoctoral Fellow-Temporary Bonding and Debonding Processes for Fan-Out Wafer-Level Packaging

Université de Sherbrooke | Sherbrooke East, Quebec | Canada | 3 months ago

3 Mar 2025 Job Information Organisation/Company Université de Sherbrooke Department Interdisciplinary Institute for Technological Innovation (3IT) Research Field Engineering » Microengineering

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