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artificial intelligence (AI), machine learning, internet of things (IoT), chip design, cybersecurity, human-computer interaction, social networks, fairness, and data ethics. Our research is rooted in basic
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sustainable materials, (d) Artificial Intelligence (AI) models to predict and control the manufacturing process and (e) a Digital Twin (DT) incl. Building Information Modeling (BIM) information backbone
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Foundation Classes (IFC), and linked data Sensors as part of Internet of Things (IoT) and integration of sensory information in simulation models during run-time Data processing, incl. artificial intelligence
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failure analysis using advanced finite element models and simulation techniques. This is enabled by digital and sensor technologies such as artificial intelligence, computer vision, drones, and robotics
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within mathematics, data science, computer science, and computer engineering, including artificial intelligence (AI), machine learning, internet of things (IoT), chip design, cybersecurity, human-computer
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computer engineering, including artificial intelligence (AI), machine learning, internet of things (IoT), chip design, cybersecurity, human-computer interaction, social networks, fairness, and data ethics
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within mathematics, data science, computer science, and computer engineering, including artificial intelligence (AI), machine learning, internet of things (IoT), chip design, cybersecurity, human-computer
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, data science, computer science, and computer engineering, including artificial intelligence (AI), machine learning, internet of things (IoT), chip design, cybersecurity, human-computer interaction
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digital technologies within mathematics, data science, computer science, and computer engineering, including artificial intelligence (AI), machine learning, internet of things (IoT), chip design
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to enhance efficiency, power density, and performance in applications such as high-performance computing (HPC) systems and artificial intelligence (AI) accelerators. Responsibilities and qualifications As a