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with hands-on expertise and demonstrated leadership in PIC technologies and industry-focused development.Key Responsibilities:As Technical Leader in Optoelectronic Packaging, the candidate will
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background in PIC packaging and testing, particularly in industry-driven environments. The selected candidate will play a key role in shaping ICFO’s strategy in this domain, contributing to leading-edge R&
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for information and communication technologies, in particular displays, image sensors and secure communications. The main drive of the group is to carry out applied research which bridges academia and industry, by
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for information and communication technologies, in particular displays, image sensors and secure communications. The main drive of the group is to carry out applied research which bridges academia and industry, by